Shenzhen Posin Circuit Technology Co., Ltd

1. Layer 1~32 layers2. Board thickness:  0.20mm-5.00mm 3. Min line width/space of outer layer : 0.0762mm4. Min line width/space of inner layer : 0.0762mm5. Max size : 500mm*800mm 6. Min hole dia. : 0.2mm (normal) ,0.10mm(laser drilling)7. Max copper thickness : 6 oz 8. Base Materials :( Normal/High TG) FR-4, CEM-3, PTFE Aluminum Base, Rogers, etc9. Surface finishing: HASL, HASL Lead Free, Golden finger, Immersion Gold, Immersion Silver, Immersion Tin, OSP/Entek [详细介绍]